Research - Faculty
Associate Professor Keith Goossen
Research Interests
Current Projects
- Devices and Imaging in the High-Terahertz Band
- High-reliability Vertical Cavity Surface Emitting Lasers (VCSEL's) and VCSEL arrays
- Integration of Optoelectronics and Optical Networks in Advanced Fiberglass/Resin Composites
- Micromechanical Large-Area Modulators for Free-space Optical Communication
- Package Design for High Performance Solar Cells
Office: Evans 202
Phone: 302-831-0590
Prof. Goossens professional experience spans industrial basic research at Bell Laboratories, co-founding a start-up company to commercialize this research, and now academic research. His work also encompasses a wide range of problems in physical electronics, particularly with respect to the integration of optical, electrical, and mechanical functionality in both devices and structures. His best known work is the first demonstration of chips comprising VLSI electronics and LSI high-speed optoelectronic arrays, which formed the core of terabit switching experiments. This integration was performed with micron-scale flip-chip bonding and is covered by 28 of Prof. Goossens 78 patents. At Aralight, Inc., the start-up co-founded by Prof. Goossen, this work was expanded upon to produce the first and only demonstrated 36 channel, > 100 Gbit/sec fiber-optic module for short-range optical communication. One of his other projects is the invention and demonstration of a micromechanical modulator that showed data modulation to 10 Mbit/second, the fastest micromechanical device ever produced in terms of data rate. A defining theme in Prof. Goossen's research is the incorporation of cross-disciplinary areas of physical engineering, ranging from semiconductor device physics and engineering, optical science and optoelectronic device engineering, electronics, thermal design, metallurgy, and mechanics in a holistic design approach to new technology. A good example of this is his current work on embedding optically-accessed local-area networks in composite structures. Finally, his background and abilities makes him an expert in the elusive science of electronic and optoelectronic packaging, including high-data rate design along with the above considerations.
