Research Centers & Facilities
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Nanofabrication Facility
Capabilities & Equipment
Etching
Fluorine RIE System
- PlasmaTherm 790 RIE
- Reacitve-ion etching tool employing capacitively-coupled plasma. It is capable of etching Si and other materials with a high aspect ratio, using the Bosch process.
Fluorine ICP System
- Samco 200 RIE-iP
- inductively coupled plasma etching system equipped with fluorine-based gasses for dry etching of silicon and germanium
Chlorine ICP System
- Samco 200 RIE-iP
- inductively coupled plasma etching systems one equipped with chlorine-based gasses for dry etching of III-V compound semiconductor materials and metals
