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Nanofabrication Facility
Capabilities & Equipment > Packaging and Integration Systems
Kulicke & Soffa wire bonder 4526
Our wire bonding system is a Kulicke & Soffa model 4526. This is a system is ideal for wire bonding a wide variety of samples. It includes a large bonding area and uses the wedge bonding technique for better results. With a built-in temperature controller and top of the line Leica optics it makes wire bonding easier than ever.
A photo of the Kulicke & Soffa wire bonder model 4526.
A photograph illustrating a wire bonded sample.
Large 5.3”x5.3” bonding surface
Can handle both aluminum and gold wire or ribbon
Motorized axies for added control
Built-in temperature controller
High quality Leica microscope for enhanced viewing of details
Along with manual modes also has the capability to run the Z axis in automatic mode
High frequency PLL ultrasonic generator and transducer
