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Nanofabrication Facility
Capabilities & Equipment > Packaging and Integration Systems
Semiconductor Equipment Corp. 860 Flip-chip Bonder
Semiconductor equipment Model 860 Omni BonderiP
Examples of opto-electronic device integration using flip-chip bonding.
Semiconductor Equipment Corporation's Model 860 is a multi-use semiautomatic system ideal for R & D and low volume production. Applications include solder and gold bumped flip chip, eutectic bonding including laser diodes and bars and epoxy bonding. Some of the process capabilities that support these applications are ultrasonic, thermosonic, scrub, flux dipping and hot gas spot heating. The Eagle's base platform includes a retractable cube beam splitter viewing system with LED lighting, precision servo-driven Z motion with closed loop bond load control, closed loop temperature controls for head, stage and spot heating. Various standard heads and stages are available.
- Single Tool Head with bond loads to 10 KG and heating to 300 degrees C.
- Ultrasonic Head with loads to 3 KG.
- Micrometer adjusted workstage for alignment in X, Y and theta. Workchucks have vacuum hold-down or mechanical clamps. Custom workchucks available.
- ¾” Rapid Heat Cycle Workstage with quick heat up ramping to 450 degrees C and heated cover gas manifold with separate temperature control.
- Retractable cube beam splitter vision system features a 12x zoom lens, digital camera, image capture, LED array lighting, electronic crosshair and a 17” LCD display.
